Easy to Integrate with Flexible Options
Featuring the smallest footprint among automation components, it is ideal for panel mounting in both existing and new enclosures. The system provides versatility with multiple input voltage options, ensuring seamless adaptability to diverse operational requirements.
With its compact footprint, this solution offers a seamless drop-in replacement for existing bonders, streamlining upgrades. Engineered with FEA-optimized sonotrodes, it ensures precision and efficiency in ultrasonic processes. The availability of standard and custom sonotrode widths further enhances adaptability, catering to a spectrum of industrial applications.
Effectively reduces your carbon footprint by replacing petroleum-based adhesives and outdated ultrasonic systems. It stands as a sustainable alternative, utilizing significantly less energy than traditional adhesive dispensing systems.
Easy to Operate
User-friendly and designed with end-user needs in mind, this system ensures easy operation through automated setup and an intuitive GUI design. It seamlessly integrates with production machinery, enhanced by Dukane's iQ LinQ™ technology.