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November 9 – 13, 2020

PACK EXPO Connects 2020 is a brand new live, web-based event like no other. Complete with live chats, live product and machinery demos, and engaging educational opportunities, this will be THE place to interact with packaging and processing professionals this year.

Pack Expo Connects 2020 A Virtual Event

Our demonstration for Why Rotary Ultrasonic Sealing for your packages?” is available on-demand right now at our virtual booth at Pack Expo Connects.

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Learn how you can achieve the following by using Rotary Ultrasonic Sealing in your packaging process by attending this demo:

  • Higher output with higher speed
  • Higher-strength seals because materials are sealed on a molecular level
  • Sealing through product residues with ultrasonic
  • Smaller footprint with a compact design
  • Sustainable green packaging solution by reducing energy consumption and material waste

Pack Expo Connects

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Rotary Ultrasonic Solutions 

Soniseal™ Series of ultrasonic bonders are designed for packaging applications such as back sealing, end/cross sealing, fin sealing, top sealing, zipper sealing/crushing and many more.

Rotary ultrasonic solutions for packaging

 Designed specifically for ultrasonic sealing packaging applications in food manufacturing where the wash-down of equipment is practiced. 

  • Reduces maintenance costs
  • Reduces energy consumption
  • Doesn’t need to be removed or bagged for cleaning. 

Aurizon® Soniseal™ 40 UL Seri

Soniseal UL Series

Patented technology to enable new capabilities in packaging applications designed for flow wrapper, VFFS, and HFFS machinery.

  • Utmost in seal consistency
  • Top control in a lightweight package
  • Maximizes seal strength, consistency, and quality.

Aurizon® Sonisolution™ RS Series

Sonisolution RS

Allows those with the technical knowledge to integrate high power ultrasonic capability into their machine designs.

  • Reduces raw materials
  • Increases process speeds
  • Improves quality and required maintenance

Aurizon® Soniseal™ 40 Series

Soniseal SD

Patented technology to enable new capabilities in packaging applications consisting of pre-engineered systems.

  • Increases productivity and reducing costs
  • Higher power delivery
  • Continuous and consistent performance 

Pack Expo Connects

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