Packaging

Reliable & High Speed Ultrasonic Packaging with Patented Technologies

Joe Re
Product Manager
Phone: 630-797-4920

Ultrasonic package sealing occurs when high frequency (ultrasonic) mechanical energy is transferred into two or more layers of thermoplastic materials. A strong, reliable molecular bond is formed between the layers.  Nearly, all packaging materials and laminates, with a thermoplastic sealing layer or coating, are suitable for the ultrasonic sealing (welding) process. Both hermetic and peelable seals can be achieved with ultrasonic sealing systems. Ultrasonics can seal through remnants like drops of liquid, or small amounts of powder or fibrous material that may be in the seal zone. The process does not require adhesives and/or solvents.

Dukane had developed advanced ultrasonic sealing solutions, which consist of patented – 100% digitally controlled – ultrasonic power supply and optimized acoustical stack [transducer (converter)/booster/horn (sonotrode)/anvil].  The stack components apply clamping force to the sealing area. At the same time, ultrasonic energy generates localized frictional heat sealing the packaging materials.

With key industry patents, reliable ultrasonic welding components and experienced application and process engineers, we are ready to support your project from beginning to end.

We will be at PACK EXPO from Oct 14th-17th of 2018. Please stop by our Booth 8909 to get live demonstration of our packaging technologies. CLICK HERE to register and use code ’82P57′ to get your complimentary badge

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Related Products

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iQ RAM (Rigid Acoustical Module), for vertical form filling machinery is designed to seal through product residues, provides faster cycle, less material consumption and strong seals. Simple installation with single 20 kHz rigid mount horn. Sealed transducer & titanium horn makes it ideal for washdown environments.
iQ RAM
Ultrasonic Pouch Sealing System
iQ Series AiM with Ultrasonic Pouch Sealing System designed to top seal stand up pouches to provide clean and consistent results. The unit can be available as a 30 or 20kHz with various sonotrode widths. This can be used as a standalone module for low volume applications or integrated into automated high-speed pouch filling /sealing machinery. Benefit of Ultrasonic top sealing is the ability to seal through contamination and product residue.
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Blister/Clamshell Sealing
iQ EZ Stapler will also be on display, which makes blister/clamshell sealing easier than ever. The welding process itself is activated with a foot-switch once the packaging material is properly positioned. The easy to learn process helps make for faster cycle times. With custom tooling, a wide variety of weld patterns or spot welds can be created. The stapler can be put on a workbench, or wall-mounted on its own support structure.
iQ EZ Stapler