We are bringing our latest Ultrasonic cutting and sealing technologies for the packaging industry.
NEW iQ RAM (Rigid Acoustical Module):
- Seals contaminated weld joints.
- Fast cycle, strong seals and reduces material consumption.
- Simple installation with single 20 kHz rigid mount horn.
- Sealed transducer & titanium horn makes it ideal for washdown environments.
New Ultrasonic Pouch Sealing Module:
- Seals stand up pouches.
- Provides clean and consistent results.
- Easily integrates into automated high speed pouch filling /sealing machinery.
- Seals through product residue.
New iQ AiMTM (Automation in Mind) Ultrasonic Generator
- Standard connectivity with EtherNet/IP or Modbus.
- Optional Anybus Module for Profinet, Profibus, Powerlink, EtherCAT, or CC-Link.
- Highly efficient power conversion with Power Factor Correction (PFC).
- Available in 15, 20, 30, 35 & 40 kHz.
We are looking forward to see you all and demonstrate our latest technologies.