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Pack Expo Connects 2020-A Virtual Event

We are bringing our latest Ultrasonic cutting and sealing technologies for the packaging industry.

NEW iQ RAM (Rigid Acoustical Module):

  • Seals contaminated weld joints.
  • Fast cycle, strong seals and reduces material consumption.
  • Simple installation with single 20 kHz rigid mount horn.
  • Sealed transducer & titanium horn makes it ideal for washdown environments.

New Ultrasonic Pouch Sealing Module:

  • Seals stand up pouches.
  • Provides clean and consistent results.
  • Easily integrates into automated high speed pouch filling /sealing machinery.
  • Seals through product residue.

New iQ AiMTM  (Automation in Mind) Ultrasonic Generator

  • Standard connectivity with EtherNet/IP or Modbus.
  • Optional Anybus Module for Profinet, Profibus, Powerlink, EtherCAT, or CC-Link.
  • Highly efficient power conversion with Power Factor Correction (PFC).
  • Available in 15, 20, 30, 35 & 40 kHz.

We are looking forward to see you all and demonstrate our latest technologies.

Registration Information

CLICK HERE to Register

Use Code 82P57 to get your Complimentary Badge

Dukane Corporate Headquarters


2900 Dukane Drive St. Charles IL 60174